<?xml version="1.0" encoding="UTF-8"?>
<!--
  ============================================================================
  QuantaRNG-USB Pro - IPC-1752A v2.0 Class C Material Declaration
  Document version: 1.0
  Issued by Dyber, Inc. to Toshiba Europe Limited

  Notes:
    - REACH SVHC reference: ECHA Candidate List of 4 February 2026, 253
      substances total (per ECHA press release ECHA/NR/26/06). Toshiba
      request document referenced 251 substances; the 2-substance gap
      is the additions made on 4 February 2026 itself (n-hexane and
      Bisphenol AF and salts).
    - RoHS Annex III exemption for Diodes parts AP2112K-3.3TRG1 (U2) and
      BAT54W-7-F (D2): Diodes-internal exemption code "(e)" per the
      Diodes Master Certificate of Conformance (Master_CofC.pdf at
      diodes.com/quality). The EU Annex III equivalent is most likely
      7c-V (lead in glass die passivation and/or encapsulation).
    - PFAS status per Diodes Master CofC (JEDEC 25 ppb threshold):
      BAT54W-7-F: PFAS column = "No" (confirmed below threshold).
      AP2112K-3.3TRG1: PFAS column = "No data" (Diodes has not yet
      published test data; clarification request submitted to
      compliance@diodes.com on or about 19 May 2026).
    - Total declared product mass: 10350.182 mg (PCBA 350.182 mg plus
      Protocase aluminum 6061-T6 anodized enclosure 10000 mg).
    - Aluminum enclosure mass is a planned value; final measured mass
      will be confirmed at Protocase first article delivery and any
      adjustment will be issued as a v1.1 amendment.

  v0.7 changelog (superseded by v1.0):
    - Removed the entire ManufacturingInfo section, including its entry in
      the Include block and the Product/ManufacturingInfo element. Toshiba's
      validator continued to reject Package/@packageDesignator with values
      "PCBA" (v3) and "Other" (v4/v5). The Package element is structurally
      designed to describe a single component package (BGA, QFN, SOIC, etc.)
      not a complete board assembly, so there is no value of
      packageDesignator that correctly describes this product. Per-component
      package information is held on file in supplier IPC-1752A documents
      from STMicroelectronics, Diodes Inc, ON Semiconductor, TI, Murata, and
      Yageo. ManufacturingInfo is optional in IPC-1752A v2.0; this declaration
      now uses MaterialInfo (subsections A and D) only, which is sufficient
      for full material disclosure of the assembled product.

  v0.5 changelog:
    - Corrected semantic encoding of Concentration values on Substance
      elements. Per IPC-1752A v2.0, Concentration/@value expresses the
      concentration of a substance within its parent HomogeneousMaterial,
      as a percentage (100 = 100%). Previous values were encoded as parts
      per million of the total product mass, which is lexically valid
      xs:decimal but semantically incorrect. Single-substance homogeneous
      materials now read 100. The mold-compound material reads 86.111 for
      Fused Silica, 13.611 for Epoxy resin, and 0.278 for Carbon Black,
      summing to 100.
    - Removed PSLRating element from ManufacturingInfo/Package. The
      QuantaRNG-USB Pro is reflow-soldered only; wave-solder parameters
      do not apply, and empty-string attributes on a typed element are
      better omitted than left blank.

  v0.4 changelog:
    - Attempted fix to schema validation error on
      ManufacturingInfo/Package/@packageDesignator: changed "PCBA" to
      "Other" with explanatory comment. Did not resolve the error.
      Superseded by v0.6 which removes the entire ManufacturingInfo
      section.
    - Removed empty-string attributes from Package and Solder elements.
  ============================================================================

  STATUS: DRAFT, NOT VALID UNTIL SIGNED AGAINST PRODUCTION DATA.

  Schema: http://webstds.ipc.org/175x/2.0
  Class: C (full material disclosure)

  This declaration is for the QuantaRNG-USB Pro as a complete assembled
  product. Per-component supplier IPC-1752A files and CoCs are held on
  file by Dyber, Inc. and are available on request. The HomogeneousMaterialList
  below aggregates substantive materials across the assembly.

  Per-component supplier documents on file:
    U1 STM32G431KBT6: ST IPC-1752A XML (705v_468xxxx.xml)
    U2 AP2112K-3.3TRG1: Diodes Inc Environmental Compliance Master List
    U3 TPS61040DBVR: TI Material Content Excel
    U4 USBLC6-2SC6: ST IPC-1752A XML
    Q1/Q2/Q3 MMBT3904LT1G: onsemi IPC-1752A XML
    D1 LED: Kingbright RoHS and REACH CoCs
    D2 BAT54W-7-F: Diodes Inc Environmental Compliance Master List
    FB1 BLM18: Murata EMI EMIFIL CoCs
    L1 LQM21: Murata Inductor CoCs
    C1-C13 Murata GRM: Murata Ceramic Capacitor CoCs
    R1-R14 Yageo RC_P: Yageo SGS test reports and CoCs

  All supplier REACH declarations reference the ECHA Candidate List
  most recently updated 4 February 2026 (253 substances).
  ============================================================================
-->

<MainDeclaration
    xmlns="http://webstds.ipc.org/175x/2.0"
    xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"
    version="2.0">

  <BusinessInfo mode="Distribute">
    <Response date="2026-05-19" docID="DYBER-QRNG-USB-MD-v1.0" fieldLock="true" comment="Issued v1.0 to Toshiba Europe Limited on 19 May 2026, signed by Zachary Kleckner, Founder and CEO. Substance data based on supplier IPC-1752A material declarations and Certificates of Conformance held on file by Dyber, Inc. and on the published Diodes Incorporated Master Certificate of Conformance (Master_CofC.pdf at diodes.com/quality). REACH SVHC reference: ECHA Candidate List of 4 February 2026 (253 substances per ECHA NR/26/06). RoHS Annex III exemption for Diodes parts U2 and D2: Diodes-internal code (e); EU Annex III equivalent most likely 7c-V. PFAS status per Diodes Master CofC at JEDEC 25 ppb threshold: BAT54W-7-F (D2) confirmed below threshold; AP2112K-3.3TRG1 (U2) Diodes lists No data, clarification pending. Aluminum 6061-T6 anodized enclosure mass 10000 mg is a planned value to be confirmed at Protocase first article delivery.">
      <Authorizer name="Zachary Kleckner" title="Founder and CEO" comment="Authorized to bind Dyber, Inc.">
        <Email address="compliance@dyber.com" type="Work"/>
        <SurfaceAddress internal="Suite 212" street="180 Admiral Cochrane Dr." city="Annapolis" stateProvince="MD" country="USA" postalCode="21401" type="Headquarters"/>
        <Phone number="+1 877-772-3927"/>
      </Authorizer>
      <SupplyCompany name="Dyber, Inc.">
        <CompanyID identity="Delaware C-Corporation, qualified to do business in Maryland" authority="State of Delaware Division of Corporations"/>
      </SupplyCompany>
      <Contact name="Zachary Kleckner" title="Founder and CEO" comment="Primary compliance contact">
        <Email address="compliance@dyber.com" type="Work"/>
        <SurfaceAddress internal="Suite 212" street="180 Admiral Cochrane Dr." city="Annapolis" stateProvince="MD" country="USA" postalCode="21401" type="Headquarters"/>
        <Phone number="+1 877-772-3927"/>
      </Contact>
    </Response>
    <Declaration legalType="Standard" supplierAcceptance="false" legalDef="Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others, including manufacturer certificates of conformance and IPC-1752A material declarations from component manufacturers, and that Supplier may not have independently verified such information. Where Supplier has not independently verified information provided by others, Supplier has obtained certifications from those manufacturers regarding their contributions to the part, and those certifications are at least as comprehensive as the certification in this paragraph." uncertaintyStatement="Information in this declaration is based on the best knowledge of Dyber, Inc. as of the issue date, derived from data provided by component manufacturers. The product is in pre-production state at the time of document version 0.3. This declaration is not valid for shipped product until updated to reflect actual production lots and signed in final form."/>
  </BusinessInfo>

  <Include>
    <Sectional name="MaterialInfo">
      <SubSectional name="A"/>
      <SubSectional name="D"/>
    </Sectional>
  </Include>

  <Product comment="QuantaRNG-USB Pro: USB-attached hardware quantum random number generator. Shot-noise entropy source, AES-CBC-MAC conditioning, USB 2.0 Full-Speed CDC-ACM interface. 30 x 18 mm, 2-layer PCB, ~5 g." unitType="Each">
    <ProductID manufacturingSite="TBD-FIRST-ARTICLE" effectiveDate="2026-05-19" version="1.0" itemName="QuantaRNG-USB Pro" itemNumber="QRNG-USB-PRO-001">
      <Amount value="350" UOM="mg"/>
      <InstanceID identity="QRNG-USB-PRO-001-DRAFT" authority="Dyber, Inc."/>
    </ProductID>

    <MaterialInfo>

      <ExemptionList>
        <ExemptionListID authority="EU RoHS 2011/65/EU Annex III"/>
        <Exemption description="Diodes Incorporated parts AP2112K-3.3TRG1 (U2) and BAT54W-7-F (D2) are listed as RoHS-compliant with Diodes-internal exemption code (e) per the Diodes Master Certificate of Conformance (Master_CofC.pdf at diodes.com/quality). The EU Annex III equivalent is most likely 7c-V (lead in glass die passivation and/or encapsulation), given that both parts are glass-passivated discrete or analog devices." identity="DIODES-E-LIKELY-7c-V"/>
        <Exemption description="Yageo RC_L resistor variant uses Annex III 7(c)-I (lead in glass) exemption. Note: BOM uses lead-free RC_P variant which does not require this exemption. Exemption listed for reference only." identity="ANNEX-III-7c-I"/>
      </ExemptionList>

      <QueryList identity="RoHS Directive 2011/65/EU - 8 June 2011 Annex II amended by Delegated Directive 2015/863 - 31 March 2015">
        <Query statement="1 - Product(s) meets EU RoHS requirement without any exemptions" response="false"/>
        <Query statement="2 - Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder 7b exemption" response="false"/>
        <Query statement="3 - Product(s) meets EU RoHS requirements by application of the selected exemption(s)" response="true"/>
        <Query statement="4 - Product(s) does not meet EU RoHS requirements and is not under exemptions" response="false"/>
        <Query statement="5 - Product(s) is obsolete, no information is available" response="false"/>
        <Query statement="6 - Product(s) is unknown, no information is available" response="false"/>
      </QueryList>

      <QueryList identity="Chinese RoHS, references SJ/T 11364">
        <Query statement="1 - Product(s) requires marking for the presence of restricted substances and must be marked with an Environmental Protection Use Period under China's Measures for Administration of the control of pollution by Electronic Information Products" response="true"/>
        <Query statement="2 - Product(s) is eligible for marking with the e code under China's Measures for Administration of the control of pollution by Electronic Information Products" response="false"/>
      </QueryList>

      <QueryList identity="REACH Regulation EC 1907/2006 Candidate List 4 February 2026 (253 substances)">
        <Query statement="1 - Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH (0.1 percent w/w of the article)" response="true"/>
      </QueryList>

      <QueryList identity="POPs Regulation EU 2019/1021 Annex I including PFOA PFOS PFHxS UV-328 UV-238 HBCDD SCCPs Dechlorane Plus">
        <Query statement="1 - Product(s) does not contain Annex I Persistent Organic Pollutants above the regulatory thresholds based on supplier declarations on file" response="true"/>
      </QueryList>

      <QueryList identity="US TSCA Section 6(h) PBT chemicals - DecaBDE PIP 3:1 2,4,6-TTBP HCBD PCTP and PFOA PFOS PFHxS">
        <Query statement="1 - Product(s) does not contain TSCA Section 6(h) restricted substances above de minimis thresholds based on supplier declarations on file. PFAS data for Diodes Incorporated parts (U2, D2) pending direct supplier confirmation." response="true"/>
      </QueryList>

      <QueryList identity="California Proposition 65 - Health and Safety Code Section 25249">
        <Query statement="1 - Product(s) has been assessed against the Prop 65 list. Default approach: apply conservative warning label on US-bound product packaging. Verified-clean determination pending optional XRF testing." response="true"/>
      </QueryList>

      <QueryList identity="Halogen-Free per IEC 61249-2-21 / JPCA-ES-01-2003 (Br less than 900 ppm, Cl less than 900 ppm, total halogens less than 1500 ppm)">
        <Query statement="1 - Product(s) component-level halogen-free status confirmed by supplier CoCs for all major BOM line items. Yageo RC_P resistors verified ND for all halogens by SGS lab testing." response="true"/>
      </QueryList>

      <HomogeneousMaterialList>

        <HomogeneousMaterial name="Silicon (active dies, U1 U3 U4 Q1 Q2 Q3)" materialGroupName="M-011 Other inorganic materials">
          <Amount UOM="mg" value="11.5"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from supplier IPC-1752A files" identity="Aggregated"/>
            <SubstanceCategory name="Semiconductor die material">
              <Substance name="Silicon">
                <SubstanceID authority="CAS" identity="7440-21-3"/>
                <Amount UOM="mg" value="11.5"/>
                <Concentration value="100"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

        <HomogeneousMaterial name="Copper (lead frames, traces, bond wires)" materialGroupName="M-011 Other inorganic materials">
          <Amount UOM="mg" value="22.0"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from supplier IPC-1752A files" identity="Aggregated"/>
            <SubstanceCategory name="Conductors">
              <Substance name="Copper">
                <SubstanceID authority="CAS" identity="7440-50-8"/>
                <Amount UOM="mg" value="22.0"/>
                <Concentration value="100"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

        <HomogeneousMaterial name="Iron (lead frame alloy in transistors and U3)" materialGroupName="M-011 Other inorganic materials">
          <Amount UOM="mg" value="4.6"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from supplier IPC-1752A files" identity="Aggregated"/>
            <SubstanceCategory name="Conductors">
              <Substance name="Iron">
                <SubstanceID authority="CAS" identity="7439-89-6"/>
                <Amount UOM="mg" value="4.6"/>
                <Concentration value="100"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

        <HomogeneousMaterial name="Nickel (plating layers)" materialGroupName="M-011 Other inorganic materials">
          <Amount UOM="mg" value="3.3"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from supplier IPC-1752A files" identity="Aggregated"/>
            <SubstanceCategory name="Plating">
              <Substance name="Nickel">
                <SubstanceID authority="CAS" identity="7440-02-0"/>
                <Amount UOM="mg" value="3.3"/>
                <Concentration value="100"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

        <HomogeneousMaterial name="Tin (lead-free plating, SAC305 solder)" materialGroupName="M-011 Other inorganic materials">
          <Amount UOM="mg" value="15.0"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from supplier IPC-1752A files and SAC305 spec" identity="Aggregated"/>
            <SubstanceCategory name="Solder and plating">
              <Substance name="Tin">
                <SubstanceID authority="CAS" identity="7440-31-5"/>
                <Amount UOM="mg" value="15.0"/>
                <Concentration value="100"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

        <HomogeneousMaterial name="Silver (SAC305 solder, die attach adhesives)" materialGroupName="M-011 Other inorganic materials">
          <Amount UOM="mg" value="1.6"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from supplier IPC-1752A files and SAC305 spec" identity="Aggregated"/>
            <SubstanceCategory name="Precious metals">
              <Substance name="Silver">
                <SubstanceID authority="CAS" identity="7440-22-4"/>
                <Amount UOM="mg" value="1.6"/>
                <Concentration value="100"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

        <HomogeneousMaterial name="Gold (bond wires, ENIG PCB finish)" materialGroupName="M-011 Other inorganic materials">
          <Amount UOM="mg" value="0.15"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from supplier IPC-1752A files" identity="Aggregated"/>
            <SubstanceCategory name="Precious metals">
              <Substance name="Gold">
                <SubstanceID authority="CAS" identity="7440-57-5"/>
                <Amount UOM="mg" value="0.15"/>
                <Concentration value="100"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

        <HomogeneousMaterial name="Palladium (lead frame plating, bond wires)" materialGroupName="M-011 Other inorganic materials">
          <Amount UOM="mg" value="0.012"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from supplier IPC-1752A files" identity="Aggregated"/>
            <SubstanceCategory name="Precious metals">
              <Substance name="Palladium">
                <SubstanceID authority="CAS" identity="7440-05-3"/>
                <Amount UOM="mg" value="0.012"/>
                <Concentration value="100"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

        <HomogeneousMaterial name="Aluminium (die metallization)" materialGroupName="M-011 Other inorganic materials">
          <Amount UOM="mg" value="0.020"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from supplier IPC-1752A files" identity="Aggregated"/>
            <SubstanceCategory name="Conductors">
              <Substance name="Aluminium">
                <SubstanceID authority="CAS" identity="7429-90-5"/>
                <Amount UOM="mg" value="0.020"/>
                <Concentration value="100"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

        <HomogeneousMaterial name="Mold compound and encapsulation (epoxy with silica filler)" materialGroupName="M-011 Other inorganic materials">
          <Amount UOM="mg" value="180.0"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from supplier IPC-1752A files" identity="Aggregated"/>
            <SubstanceCategory name="Inorganic filler">
              <Substance name="Fused Silica">
                <SubstanceID authority="CAS" identity="60676-86-0"/>
                <Amount UOM="mg" value="155.0"/>
                <Concentration value="86.111"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from supplier IPC-1752A files" identity="Aggregated"/>
            <SubstanceCategory name="Polymer matrix">
              <Substance name="Epoxy resin (cresol novolac type)">
                <SubstanceID authority="CAS" identity="85954-11-6"/>
                <Amount UOM="mg" value="24.5"/>
                <Concentration value="13.611"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from supplier IPC-1752A files" identity="Aggregated"/>
            <SubstanceCategory name="Pigment">
              <Substance name="Carbon Black">
                <SubstanceID authority="CAS" identity="1333-86-4"/>
                <Amount UOM="mg" value="0.5"/>
                <Concentration value="0.278"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

        <HomogeneousMaterial name="PCB substrate (FR4, halogen-free, lead-free)" materialGroupName="M-011 Other inorganic materials">
          <Amount UOM="mg" value="100.0"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Estimated, pending PCB fab CoC at first article" identity="Estimated"/>
            <SubstanceCategory name="PCB laminate">
              <Substance name="FR4 epoxy laminate, halogen-free">
                <SubstanceID authority="CAS" identity="Mixture"/>
                <Amount UOM="mg" value="100.0"/>
                <Concentration value="100"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

        <HomogeneousMaterial name="Ceramic dielectric (MLCC capacitors C1-C13)" materialGroupName="M-011 Other inorganic materials">
          <Amount UOM="mg" value="10.0"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from Murata GRM series CoCs" identity="Aggregated"/>
            <SubstanceCategory name="Ceramic dielectric">
              <Substance name="Barium Titanate (X7R, X5R, C0G ceramics)">
                <SubstanceID authority="CAS" identity="12047-27-7"/>
                <Amount UOM="mg" value="10.0"/>
                <Concentration value="100"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

        <HomogeneousMaterial name="Resistor element (thick film, RC_P series, lead-free)" materialGroupName="M-011 Other inorganic materials">
          <Amount UOM="mg" value="2.0"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Aggregated from Yageo RC_P SGS test report SHAEC25030900331" identity="Aggregated"/>
            <SubstanceCategory name="Thick film resistor element">
              <Substance name="Ruthenium oxide thick film (lead-free)">
                <SubstanceID authority="CAS" identity="12036-10-1"/>
                <Amount UOM="mg" value="2.0"/>
                <Concentration value="100"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

        <HomogeneousMaterial name="Aluminum 6061-T6 enclosure (Type II anodized, Protocase)" materialGroupName="M-002 Aluminium and aluminium alloys">
          <Amount UOM="mg" value="10000.0"/>
          <SubstanceCategoryList>
            <SubstanceCategoryListID authority="Protocase Inc. Material Certification, to be issued at first article" identity="Aggregated"/>
            <SubstanceCategory name="Enclosure metal">
              <Substance name="Aluminum 6061-T6 alloy with Type II clear sulfuric anodize coating per MIL-A-8625">
                <SubstanceID authority="CAS" identity="7429-90-5"/>
                <Amount UOM="mg" value="10000.0"/>
                <Concentration value="100"/>
                <SubstanceExemption description="" identity=""/>
              </Substance>
            </SubstanceCategory>
          </SubstanceCategoryList>
        </HomogeneousMaterial>

      </HomogeneousMaterialList>
    </MaterialInfo>

  </Product>

</MainDeclaration>
