Environmental and regulatory compliance declarations for the QuantaRNG USB Pro quantum random number generator.
Restriction of Hazardous Substances compliance declaration. Confirms absence of lead, mercury, cadmium, hexavalent chromium, PBBs, PBDEs, and four phthalates.
Registration, Evaluation, Authorization and Restriction of Chemicals. Declaration of compliance with the ECHA Candidate List of 4 February 2026 (253 Substances of Very High Concern).
Declaration confirming no Annex XIV (Authorization List) substances are intentionally added to or present above threshold in the QuantaRNG USB Pro.
Article 33 duty to communicate information on Substances of Very High Concern in articles to recipients and consumers.
Declaration of compliance with the EU Deforestation-free Products Regulation. Due diligence on raw material supply chains.
Compliance declaration under the EU Packaging and Packaging Waste Regulation. Covers packaging materials, recyclability, and substance restrictions.
Safe Drinking Water and Toxic Enforcement Act of 1986. Declaration regarding chemicals known to the State of California to cause cancer or reproductive toxicity.
Declaration of compliance with TSCA Section 6(h) prohibitions and restrictions on persistent, bioaccumulative, and toxic (PBT) chemicals.
Full material declaration per IPC-1752A Class C standard. Detailed substance and material composition reporting. View interactively below or download the XML.
Compliance declaration under Canada's Statutory Orders and Regulations SOR/2025-270 environmental product requirements.
Chemical Substances Control Law compliance. Declaration regarding Class I and Class II specified chemical substances under Japanese regulation.
IPC-1752A v2.0 Class C full material declaration for the QuantaRNG USB Pro. Document ID: DYBER-QRNG-USB-MD-v1.0
| Material | Substance | CAS | Mass (mg) | Conc. (%) |
|---|---|---|---|---|
| Silicon (active dies) | Silicon | 7440-21-3 | 11.500 | 100 |
| Copper (leads, traces, bond wires) | Copper | 7440-50-8 | 22.000 | 100 |
| Tin (plating, SAC305 solder) | Tin | 7440-31-5 | 15.000 | 100 |
| Mold compound (epoxy + silica) | Fused Silica | 60676-86-0 | 155.000 | 86.111 |
| Epoxy resin (cresol novolac) | 85954-11-6 | 24.500 | 13.611 | |
| Carbon Black | 1333-86-4 | 0.500 | 0.278 | |
| PCB substrate (FR4, halogen-free) | FR4 epoxy laminate, halogen-free | Mixture | 100.000 | 100 |
| Ceramic dielectric (MLCC C1-C13) | Barium Titanate | 12047-27-7 | 10.000 | 100 |
| Iron (lead frame alloy) | Iron | 7439-89-6 | 4.600 | 100 |
| Nickel (plating layers) | Nickel | 7440-02-0 | 3.300 | 100 |
| Resistor element (thick film) | Ruthenium oxide (lead-free) | 12036-10-1 | 2.000 | 100 |
| Silver (SAC305, die attach) | Silver | 7440-22-4 | 1.600 | 100 |
| Gold (bond wires, ENIG) | Gold | 7440-57-5 | 0.150 | 100 |
| Aluminium (die metallization) | Aluminium | 7429-90-5 | 0.020 | 100 |
| Palladium (lead frame plating) | Palladium | 7440-05-3 | 0.012 | 100 |
| PCBA Subtotal | 350.182 | |||
| Aluminum 6061-T6 enclosure | Al 6061-T6 alloy, Type II anodized (MIL-A-8625) | 7429-90-5 | 10,000.000 | 100 |
| Total Declared Mass | 10,350.182 | mg | ||
Diodes Incorporated parts AP2112K-3.3TRG1 (U2) and BAT54W-7-F (D2) are listed as RoHS-compliant with Diodes-internal exemption code (e) per the Diodes Master Certificate of Conformance. The EU Annex III equivalent is most likely 7c-V (lead in glass die passivation and/or encapsulation), given that both parts are glass-passivated discrete or analog devices.
Yageo RC_L resistor variant uses Annex III 7(c)-I (lead in glass) exemption. Note: BOM uses lead-free RC_P variant which does not require this exemption. Listed for reference only.
BAT54W-7-F (D2): PFAS confirmed below JEDEC 25 ppb threshold per Diodes Master CofC.
AP2112K-3.3TRG1 (U2): Diodes lists "No data" for PFAS. Clarification request submitted to compliance@diodes.com.
Contact our compliance team for custom declarations, translated versions, or regulatory questions specific to your jurisdiction.